| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K6R4016V1D-UC12 | SAMSUNG/三星 | TSOP | 06+ | 5000 | 2026-09-02 | |||
| K6R4016V1D-UC15 | SAMSUNG/三星 | TSOP | 06+ | 5000 | 2026-09-02 | |||
| K6R4016V1D-UI15 | SAMSUNG/三星 | TSOP | 06+ | 5000 | 2026-09-02 | |||
| BS62LV256SCP-70 | BSI | SOP | 12+ | 5000 | 2026-09-02 | |||
| BS62LV256SCP-55 | BSI | SOP | 12+ | 5000 | 2026-09-02 | |||
| BS62LV256SIP-70 | BSI | SOP | 12+ | 5000 | 2026-09-02 | |||
| BS62LV256SIP-55 | BSI | SOP | 12+ | 5000 | 2026-09-02 | |||
| K8D6316UTM-PI07 | SAMSUNG/三星 | TSOP | 05+ | 3000 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TC58V64AFTI | TOSHIBA/东芝 | TSOP | 02+ | 300 | 2026-09-02 | |||
| K6R4008V1D-TI10 | SAMSUNG/三星 | TSOP | 04+ | 2000 | 2026-09-02 | |||
| K6T4008C1B-GL55 | SAMSUNG/三星 | SOP | 04+ | 1000 | 2026-09-02 | |||
| AT29LV040A-20TI | ATMEL/爱特梅尔 | TSOP | 05+ | 2000 | 2026-09-02 | |||
| AT29LV040A-15TI | ATMEL/爱特梅尔 | TSOP | 05+ | 2000 | 2026-09-02 | |||
| K6X8016C3B-TB70 | SAMSUNG/三星 | TSOP | 08+ | 3000 | 2026-09-02 | |||
| K6X8016C3B-TF70 | SAMSUNG/三星 | TSOP | 09+ | 2000 | 2026-09-02 | |||
| K6R4016V1D-UC10 | SAMSUNG/三星 | TSOP | 06+ | 5000 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K8D6316UTM-PI07 | SAMSUNG/三星 | TSOP | 05+ | 3000 | 2026-09-02 | |||
| K4S561632K-UC75 | SAMSUNG/三星 | TSOP | 07+ | 3000 | 2026-09-02 | |||
| M28W640FCB70N6E | ST/意法 | TSOP | 04+ | 1000 | 2026-09-02 | |||
| LH28F320S3HNS-L11 | SHARP/夏普 | TSOP | 07+ | 2000 | 2026-09-02 | |||
| K6F1008U2C-YF70 | SAMSUNG/三星 | TSOP | 02+ | 2000 | 2026-09-02 | |||
| M68AW511AM70NC6 | ST/意法 | TSOP | 06+ | 3000 | 2026-09-02 | |||
| K8D6316UBM-PI07 | SAMSUNG/三星 | TSOP | 05+ | 3000 | 2026-09-02 | |||
| W9812G6GH-75 | WINBOND/华邦 | TSOP | 06+ | 5000 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AT45DB321C-RU | ATMEL/爱特梅尔 | SOP | 06+ | 530 | 2026-09-02 | |||
| H5PS1G63KFR-Y5C | SKHYNIX/海力士 | BGA | 14+ | 1600 | 2026-09-02 | |||
| H5TQ4G83AFR-PBC | SKHYNIX/海力士 | BGA | 15+ | 223 | 2026-09-02 | |||
| AT49BV1614T-11TI | ATMEL/爱特梅尔 | TSOP | 02+ | 576 | 2026-09-02 | |||
| MT28F800B5SG-8:B | MICRON/美光 | SOP | 11+ | 3000 | 2026-09-02 | |||
| MT47H64M16NF-25E:M | MICRON/美光 | BGA | 15+ | 667 | 2026-09-02 | |||
| IS63LV1024L-12JL | ISSI/芯成 | SOJ | 06+ | 5000 | 2026-09-02 | |||
| CY62157EV30LL-45ZSXI | CYPRESS/赛普拉斯 | TSOP | 05+ | 1000 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| W9812G6IH-6 | WINBOND/华邦 | TSOP | 06+ | 5000 | 2026-09-02 | |||
| EN29LV320T-70TCP | EON/宜扬 | TSOP | 06+ | 1920 | 2026-09-02 | |||
| AT49LV040-12VC | ATMEL/爱特梅尔 | TSOP | 00+ | 2079 | 2026-09-02 | |||
| 39VF1602-70-4C-EKE | SST/超捷 | TSOP | 07+ | 923 | 2026-09-02 | |||
| IS61SP12832-133TQ | ISSI/芯成 | TSOP | 03+ | 2000 | 2026-09-02 | |||
| 24C02N | ATMEL/爱特梅尔 | SOP | 200 | 2026-09-02 | ||||
| 74LVC00AD | NXP/恩智浦 | SOP | 50 | 2026-09-02 | ||||
| A3S12D40ETP-G5 | ZENTEL/力积 | TSOP | 07+ | 20 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NCEMAD9D-16G | FORESEE/江波龙 | BGA | 20+ | 133 | 2026-09-02 | |||
| W25Q256JVEIQ | WINBOND/华邦 | QFN | 20+ | 200 | 2026-09-02 | |||
| MX25L12835FZ2I-10G | MXIC/旺宏 | QFN | 20+ | 120 | 2026-09-02 | |||
| MX25L25635FZ2I-10G | MXIC/旺宏 | QFN | 20+ | 100 | 2026-09-02 | |||
| MX25L12835FMI-10G | MXIC/旺宏 | SOP | 20+ | 1900 | 2026-09-02 | |||
| MX25L6433FMI-08G | MXIC/旺宏 | SOP | 20+ | 50 | 2026-09-02 | |||
| MX30LF1G08AA-TI | MXIC/旺宏 | TSOP | 13+ | 148 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S29GL128N11TFI02 | SPANSION/飞索半导体 | TSOP | 05+ | 2000 | 2026-09-02 | |||
| CD74HC4051PWR | TI/德州仪器 | TTSOP | 18+ | 150 | 2026-09-02 | |||
| LCMXO640C-3FTN256C | LATTICE/莱迪思 | BGA | 12+ | 113 | 2026-09-02 | |||
| 80HCPS1848CBRI-L | IDT | BGA | 14+ | 331 | 2026-09-02 | |||
| NC7WZ16P6X | ONSEMI/安森美 | SOT | 10+ | 105 | 2026-09-02 | |||
| LFE3-150EA-8FN1156I | LATTICE/莱迪思 | BGA | 13+ | 171 | 2026-09-02 | |||
| SN74LV21ADR | TI/德州仪器 | SOP | 20+ | 100 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| CY7C1041CV33-10ZXC | CYPRESS/赛普拉斯 | TSOP | 04+ | 4000 | 2026-09-02 | |||
| A3S56D40FTP-G5 | ZENTEL/力积 | TSOP | 05+ | 38 | 2026-09-02 | |||
| LCMXO1200C-4FTN256C-3I | LATTICE/莱迪思 | BGA | 14+ | 1300 | 2026-09-02 | |||
| BCM5389KFBG | BROADCOM/博通 | BGA | 14+ | 360 | 2026-09-02 | |||
| RTL8812BU | REALTEK/瑞昱 | QFN | 20+ | 200 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UM809TS | UNION/英联 | SOT | 14+ | 1000 | 2026-09-02 | |||
| TL494CD | TI/德州仪器 | SOP | 12+ | 100 | 2026-09-02 | |||
| TPS53314RGFR | TI/德州仪器 | QFN | 17+ | 300 | 2026-09-02 | |||
| SPHE8368 | SUNPLUS/凌阳 | QFP | 20+ | 60 | 2026-09-02 | |||
| MT6392A | MTK/联发科 | BGA | 20+ | 130 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ADV7842KBCZ-5 | ADI/亚德诺 | BGA | 13+ | 143 | 2026-09-02 | |||
| DS90C032TM | NS/美国国半 | SOP | 20+ | 60 | 2026-09-02 | |||
| IS61WV102416BLL-10MLI | ISSI/芯成 | TSOP | 14+ | 200 | 2026-09-02 | |||
| USB3317 | SMSC | QFN | 17+ | 200 | 2026-09-02 | |||
| DS90CF364AMTD | NS/美国国半 | TSOP | 17+ | 200 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| W9751G8KB-25 | WINBOND/华邦 | BGA | 16+ | 1 | 2026-09-02 | |||
| W971GG8KB-25 | WINBOND/华邦 | BGA | 12+ | 2 | 2026-09-02 | |||
| W971GG8SB-25 | WINBOND/华邦 | BGA | 18+ | 3 | 2026-09-02 | |||
| W971GG8SR-25 | WINBOND/华邦 | BGA | 18+ | 1 | 2026-09-02 | |||
| K4T1G164QF-BCE7 | SAMSUNG/三星 | BGA | 16+ | 3 | 2026-09-02 | |||
| K4T51163QQ-BIE6 | SAMSUNG/三星 | BGA | 15+ | 6 | 2026-09-02 | |||
| K4T51163QQ-HCE6 | SAMSUNG/三星 | BGA | 15+ | 30 | 2026-09-02 | |||
| K4T1G164QF-BCE6 | SAMSUNG/三星 | BGA | 13+ | 33 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K9K8G08U0E-SCBO | SAMSUNG/三星 | TSOP | 14+ | 80 | 2026-09-02 | |||
| SST39VF400A-70-4C-B3KE | SST/超捷 | BGA | 06+ | 2350 | 2026-09-02 | |||
| K9F4G08UOD-SCBO | SAMSUNG/三星 | TSOP | 11+ | 114 | 2026-09-02 | |||
| S29AL016M90TFI02 | SPANSION/飞索半导体 | TSOP | 17+ | 253 | 2026-09-02 | |||
| K9F1208ROC-JIBO | SAMSUNG/三星 | BGA | 10+ | 162 | 2026-09-02 | |||
| E1116AJBG-8E-F | ELPIDA/尔必达 | BGA | 14+ | 2 | 2026-09-02 | |||
| H5PS1G63EFR-S5C | SKHYNIX/海力士 | BGA | 11+ | 5 | 2026-09-02 | |||
| W971GG8KB-25 | WINBOND/华邦 | BGA | 12+ | 2 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT46H16M32LFB5-6IT:C | MICRON/美光 | BGA | 14+ | 85 | 2026-09-02 | |||
| K4S511632D-UC75 | SAMSUNG/三星 | TSOP | 11+ | 200 | 2026-09-02 | |||
| S34ML04G200BHI00 | SPANSION/飞索半导体 | BGA | 16+ | 3210 | 2026-09-02 | |||
| KMSJS000KM-B308 | SAMSUNG/三星 | BGA | 12+ | 5 | 2026-09-02 | |||
| MT29F1G01AAADDH4-IT:D | MICRON/美光 | BGA | 12+ | 243 | 2026-09-02 | |||
| MT29F1G08ABBDAGE-IT:D | MICRON/美光 | BGA | 12+ | 3 | 2026-09-02 | |||
| K9F4G08UOA-PIBO | SAMSUNG/三星 | TSOP | 08+ | 11 | 2026-09-02 | |||
| AM29F010B-90EC | ADVANCED MICRO DEVICES | TSOP | 09+ | 241 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT29F4G08ABBDAH4:D | MICRON/美光 | BGA | 11+ | 7 | 2026-09-02 | |||
| MT29F16G08ADBCAH4-IT:C | MICRON/美光 | BGA | 12+ | 1 | 2026-09-02 | |||
| MT41K256M16TW-125:P | MICRON/美光 | BGA | 18+ | 22 | 2026-09-02 | |||
| K4B4G0846Q-HYKO | SAMSUNG/三星 | BGA | 13+ | 12 | 2026-09-02 | |||
| HY27US08561A-TPCB | SKHYNIX/海力士 | TSOP | 16+ | 1000 | 2026-09-02 | |||
| H5PS1G63KFR-Y5C | SKHYNIX/海力士 | BGA | 16+ | 209 | 2026-09-02 | |||
| W971GG8SB-25 | WINBOND/华邦 | BGA | 18+ | 3 | 2026-09-02 | |||
| K4T1G164QF-BCE6 | SAMSUNG/三星 | BGA | 13+ | 33 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| S34ML08G101BHI00 | SPANSION/飞索半导体 | BGA | 17+ | 71 | 2026-09-02 | |||
| SR3593L | SPREADTRUM/展讯 | BGA | 17+ | 92 | 2026-09-02 | |||
| DM3725CUS100 | TI/德州仪器 | BGA | 18+ | 8 | 2026-09-02 | |||
| K4T1G164QG-BCF7 | SAMSUNG/三星 | BGA | 16+ | 41 | 2026-09-02 | |||
| PM8015 | QUALCOMM/高通 | BGA | 15+ | 3980 | 2026-09-02 | |||
| M2S010-FGG484I | MICROSEMI/美高森美 | BGA | 17+ | 150 | 2026-09-02 | |||
| S29GL01GS10TFI01 | SPANSION/飞索半导体 | BGA | 17+ | 18 | 2026-09-02 | |||
| MT3332N | MTK/联发科 | QFN | 15+ | 15 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BCM5389KFBG | BROADCOM/博通 | BGA | 19+ | 2 | 2026-09-02 | |||
| NCT6796D | NUVOTON/新唐 | LQFP | 19+ | 4 | 2026-09-02 | |||
| MX29LV640DBTC-90G | MXIC/旺宏 | TSOP | 08+ | 88 | 2026-09-02 | |||
| MX29LV640DBTC-90G | MXIC/旺宏 | TSOP | 07+ | 50 | 2026-09-02 | |||
| MTFC8GACAENS-AAT | MICRON/美光 | BGA | 19+ | 249 | 2026-09-02 | |||
| RK3368 | ROCKCHIP/瑞芯微 | BGA | 15+ | 2 | 2026-09-02 | |||
| AR6103G-BM2D | QUALCOMM/高通 | BGA | 14+ | 1500 | 2026-09-02 | |||
| KLM8G1GENS-B041 | SAMSUNG/三星 | BGA | 17+ | 20 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT29F1G08ABAEAWP:E | MICRON/美光 | TSOP | 18+ | 20 | 2026-09-02 | |||
| KLM4G1FETE-B041 | SAMSUNG/三星 | BGA | 19+ | 173 | 2026-09-02 | |||
| MX25L6406EZNI-12GF | MXIC/旺宏 | QFN | 18+ | 139 | 2026-09-02 | |||
| MX30LF2GE8AB-TI | MXIC/旺宏 | TSOP | 16+ | 13 | 2026-09-02 | |||
| MX25L3206EXCI-12G | MXIC/旺宏 | BGA | 16+ | 30 | 2026-09-02 | |||
| MX30LF4G18AC-XKI | MXIC/旺宏 | BGA | 16+ | 50 | 2026-09-02 | |||
| MX30LF2G18AC-XKI | MXIC/旺宏 | BGA | 16+ | 85 | 2026-09-02 | |||
| MX30LF4G18AC-XKI | MXIC/旺宏 | BGA | 15+ | 10 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| AXP813 | X-POWERS/芯智汇 | QFN | 17+ | 17 | 2026-09-02 | |||
| AXP813 | X-POWERS/芯智汇 | BGA | 16+ | 33 | 2026-09-02 | |||
| AXP223 | X-POWERS/芯智汇 | QFN | 16+ | 21 | 2026-09-02 | |||
| MT6392A | MTK/联发科 | BGA | 19+ | 700 | 2026-09-02 | |||
| SPHE8288T | SUNPLUS/凌阳 | QFN | 19+ | 32 | 2026-09-02 | |||
| TPS65185RSLR | TI/德州仪器 | QFN | 12+ | 500 | 2026-09-02 | |||
| AXP223 | X-POWERS/芯智汇 | QFN | 17+ | 13 | 2026-09-02 | |||
| SENK15-AB | SAMSUNG/三星 | BGA | 16+ | 1 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| UT3232G-P16-R | UTC/友顺 | SOP | 16+ | 600 | 2026-09-02 | |||
| GL850G | GENESYS/创惟科技 | SOP | 12+ | 20 | 2026-09-02 | |||
| RTL8201CP | REALTEK/瑞昱 | QFP | 10+ | 3 | 2026-09-02 | |||
| TUSB1211A1ZRQR | TI/德州仪器 | BGA | 17+ | 130 | 2026-09-02 | |||
| TC58BVG0S3HTA00 | TOSHIBA/东芝 | TSOP | 10+ | 153 | 2026-09-02 | |||
| 88DE3006-BTK2 | MARVELL/迈威 | BGA | 17+ | 200 | 2026-09-02 | |||
| W29N02GVBIAA | WINBOND/华邦 | TSOP | 16+ | 147 | 2026-09-02 | |||
| TC58BVG0S3HTA00 | TOSHIBA/东芝 | TSOP | 15+ | 9 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| BCM54616COKFBG | BROADCOM/博通 | BGA | 16+ | 23 | 2026-09-02 | |||
| SN74LVTH125D | TI/德州仪器 | SOP | 19+ | 300 | 2026-09-02 | |||
| S29GL256N11FAI02 | SPANSION/飞索半导体 | BGA | 07+ | 30 | 2026-09-02 | |||
| CY7C1414KV18-250BZXC | CYPRESS/赛普拉斯 | BGA | 12+ | 274 | 2026-09-02 | |||
| SN74HC7001DT | TI/德州仪器 | SOP | 19+ | 73 | 2026-09-02 | |||
| MT6391A | MTK/联发科 | BGA | 18+ | 30 | 2026-09-02 | |||
| SN74CBTLV3253DBQR | TI/德州仪器 | SOP | 18+ | 100 | 2026-09-02 | |||
| CS42L52-CNZ | CIRRUS LOGIC/凌云 | QFN | 14+ | 300 | 2026-09-02 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4B1G1646I-BYMA | SAMSUNG/三星 | BGA | 18+ | 31 | 2026-09-02 | |||
| IS43LR16160G-6BLI | ISSI/芯成 | BGA | 10+ | 568 | 2026-09-02 | |||
| MT41K512M16HA-125:A | MICRON/美光 | BGA | 18+ | 2 | 2026-09-02 | |||
| MT40A512M16JY-083E:B | MICRON/美光 | BGA | 19+ | 4 | 2026-09-02 | |||
| H5TC2G63GFR-PBA | SKHYNIX/海力士 | BGA | 15+ | 49 | 2026-09-02 | |||
| K4B1G1646I-BYMA | SAMSUNG/三星 | BGA | 18+19+ | 24 | 2026-09-02 | |||
| MT47H128M8SH-25E:M | MICRON/美光 | BGA | 16+ | 6 | 2026-09-02 | |||
| K4B2G1646F-BCNB | SAMSUNG/三星 | BGA | 18+ | 52 | 2026-09-02 |